龙8老虎机pt,龙8国际pt官方网站: Product Change Notifications (PCNs)

龙8老虎机pt,龙8国际pt官方网站,希望“十三五”规划对残疾人的关注更多、措施更实在。来源:南开大学KAB创业俱乐部”几个月下来,方刚瘦了整整5公斤。三流学校二流专业学生的职业困惑发布时间:2006-12-07来源:作者:北森测评公司研发部项目经理GCDF(全球职业规划师)谢伟编者按随机调查表明,大部分人在从事一个工作之前,并不知道该工作是否理想。

他表示经过第一期、第二期四川大学创业实践活动的验证,该项目走出了一条校企合作“双赢”的新路子,是一次校企合作的成功实践,锦宏集团和川大具有长期的合作基础和良好的合作关系,将继续支持项目的实施,明年将郫县项目和龙泉阳光体育城联合起来,组建七个项目组,为川大学子提供更多展示能力和才华的平台。据昌乐县县长曹晓楠介绍,经山东省地质部门详查,探明昌乐境内蓝宝石有矿面积达450多平方公里,储量数十亿克拉,是目前国内最大的蓝宝石矿区,此次中国特产文化节与昌乐第七届中国国际宝石节同时举办,主旨是借助中国特产文化节平台,突出昌乐蓝宝石文化特色。”同,刘总对同学们深入到了集团生产、经营、管理的一线所付出的辛勤劳动表示感谢,也因为团队成员的务实和创新而大有感触,他认为无论是酒店组的素拓婚礼,还是营销组的老年团康,亦或是素拓的心理素拓,餐饮团队的学生啤酒节都是具有极强的可操作性和创新性的,这对于企业拓展下一步经营的思路、规划下一步发展的蓝图以及完善企业自身的经营管理都具有极其重要的意义。我们的员工是企业编制的,他们只做科技园区相关的事情,跟学校没有太大关系,只不过这些有一部分人是我们学校的。

  特别是国开行资金的提供还带动了其他银行资金的介入,解决了小企业融资无门的困境。  中国残联网站注重以人为本,倡导和实践信息无障碍理念,遵循国际标准,集合先进技术,为视力残疾人、认知能力有障碍人士和老年人提供获取网上信息的渠道。答辩开始,先由各公司CEO以PPT的形式进行项目陈述,其中主要包括市场分析、销售策略、人员管理、利润核算、市场风险等方面的内容,详细的阐述了对未来发展的规划,表现出对创业的信心和魄力。在KAB我是2010年参加的培训,培训以后我们经过了一个学期的准备,就把这个教学方式引到了学校来做。

龙8老虎机pt,龙8国际pt官方网站

Available PCNs are listed in the table below.

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PCN Title Notice Date Affected Devices/Packages Category
08A-17 Notification of Intent to Discontinue Select Devices 11/7/17 SC25, SC40, SC80, M4A3-192, SiI3811 Discontinuance
07A-17 Notification of ECP5 285-csfBGA Package MSL Rating Upgrade from MSL5 to MSL3 11/20/17 ECP5 Material Set,
Other
06A-17 MachXO3™ Family Data Sheet and Selected MachXO3 BGA Packages Material Set 10/22/17 MachXO3 Data Sheet,
Material Set
05A-17 Upgrade of Selected BGA Substrates to Green Materials 10/22/17 LatticeECP3, LatticeXP2, MachXO, LatticeSC Material Set
04A-17 ECP5 Data Sheet Change 5/8/17 ECP5 Data Sheet
14A-16 MOD6320_6321-PAIR OPN Discontinuance and Last Time Buy 12/16/16 MOD6320_6321-PAIR Discontinuance
13A-16 Notification of Changes to Device Topside Mark for Silicon Image Products and Shipping Box/Label Design for all Lattice Products 10/31/16 All Products Other
12A-16 Notification of Intent to Utilize an Alternate Qualified Test Site for the iCE40 Ultra, iCE40 UltraLite, and LIF-UC120 WLCSP Package Devices 8/29/16 iCE40 Ultra, iCE40 UltraLite, USB Type-C Test Site
11A-16 Notification of Changes to the iCE40 Ultra and iCE40 UltraLite Data Sheets 8/1/16 iCE40 Ultra, iCE40 UltraLite Data Sheet
10A-16 Notification of Intent to Utilize an Alternate Qualified Mask Set for the iCE40 UltraLite™ Products 7/25/16 iCE40 UltraLite Mask Set
09A-16 Notification of Changes to the L-ASC10 and Platform Manager 2 Data Sheets 6/13/16 L-ASC10, Platform Manager 2 Data Sheet
08A-16 Notification of Intent to Utilize an Alternate Qualified Mask Set for the Sil5293ANU Products 6/20/16 ASSP Mask Set
07B-16 Notification of Intent to Utilize an Alternate Qualified Material Set, Assembler and Test Facility for the MachXO2-1200ZE 25 WLCSP Package Devices 5/31/16 MachXO2 Assembly Site,
Material Set,
Test Site
06A-16 Notification of Intent to Discontinue Select Mature Devices 4/25/16 ASSP Discontinuance
04A-16 Notification of Intent to utilize an Alternate Qualified Mask Set for the Sil9777CLUC Products 5/9/16 ASSP Mask Set
03A-16 Notification of Changes to the MachXO2 and MachXO3 Family Data Sheets 3/21/16 MachXO2, MachXO3 Data Sheet
02A-16 ECP5 product family related updates in Lattice Diamond v3.7 software release 3/1/16 ECP5, ECP5-5G Other
01A-16 Special Requirements for HDCP 2.X Products 2/16/16 ASSP Other
03A-15 Notification of Intent to utilize an Alternate Qualified Foundry and Alternate Qualified Mask Sets for the FPGA and Power Management sections of the Platform Manager products 11/23/15 Platform Manager Foundry, Mask Set, Material Set
02A-15 Notification of Intent to Discontinue All SnPb (Tin/Lead) Ordering Part Numbers along with Select Mature Product Families 6/23/15 ispClock, ispGDXV/VA, ispGDX2, ispLSI 1000E/EA, ispLSI 2000A/E/VE, ispLSI 5000VA/VE, ispMach 4000, ispMACH 4A3/5, LatticeECP2/M, LatticeECP3, LatticeSC/M, LatticeXP2, MachXO, Power Manager II Discontinuance
01A-15 Revision to the Platform Manager 2 and L-ASC10 Data Sheets 4/28/15 Platform Manager 2 Data Sheet
08A-14 Revision to iCE40Ultra Data Sheet 11/24/14 iCE40Ultra Data Sheet
07A-14 90-Day Notification of Intent to Utilize an Alternate Qualified Foundry Site and Alternate Qualified Mask Sets for the LA-MachXO Family 12/18/14 MachXO Foundry,
Mask Set
06B-14 Notification of Intent to Utilize an Alternate Qualified Assembly Site/Test Site and Alternate Qualified Material Sets for Select Lattice Products 11/24/14 MachXO, MachXO2, LatticeECP2, LatticeECP3, LatticeXP2, ispMACH 4000V/B/C/ZC, ispMACH 4000ZE Assembly Site,
Material Set
05A-14 Notification of Intent to Utilize an Alternate Qualified Foundry and Alternate Qualified Mask Sets for the MachXO Products 6/9/14 MachXO Foundry,
Mask Set
04A-14 Notification of Intent to Utilize an Alternate Qualified Material Set for the iCE40 144-pin TQFP Package Devices 6/2/14 iCE40HX1K-TQ144, iCE40HX4K-TQ144 Material Set
03B-14 Notification of Intent to Utilize an Alternate Qualified Assembly Site/Test Site and/or Alternate Qualified Material Sets for Select Lattice Products 11/24/14 MachXO, MachXO2, LatticeECP2/M, LatticeECP3, LatticeXP2, ispMACH 4000V/B/C/ZC, ispMACH 4000ZE Assembly Site,
Material Set
02A-14 Notification of Tape and Reel Shipping Box Specification Change for Select Package Devices 3/24/14 Package Size 5x5mm or Smaller Other
01A-14 Notification of Intent to Utilize an Alternate Qualified Mask Set for the iCE40LP1K Products 1/06/14 iCE40LP1K Mask Set
11A-13 Notification of Intent to Discontinue ispPAC-POWR6AT6-01S32I 11/11/13 ispPAC-POWR6AT6-01S32I Discontinuance
10A-13 Notification of Changes to the MachXO2 Family Data Sheet 9/30/13 MachXO2 Data Sheet
09A-13 Notification of Changes to the ispPAC-POWR1014/A, LA-ispPAC-POWR1014/A, ispPAC-POWR6AT6 and ispPAC-POWR1220AT8 Family Data Sheets 9/30/13 ispPAC-POWR1014/A, LA-ispPAC-POWR1014/A, ispPAC-POWR1220AT8, ispPAC-POWR6AT6 Data Sheet
08A-13 Notification of Intent to Utilize an Alternate Qualified Test Site for Select Lattice Products 9/30/13 iCE40, ispMACH 4000ZE, LatticeECP2/M, LatticeECP3, LatticeXP2, MachXO/2 Other
07A-13 Notification of Changes to the iCE40 LP/HX Family Data Sheet 9/30/13 iCE40LP1K-CM49/TR, iCE40LP8K-CM81 Data Sheet
06B-13 Notification of Intent to Discontinue LatticeEC/P and LatticeXP Product Families 7/25/13 LatticeEC/P, LatticeXP Discontinuance
06A-13 Advance Change Notification of Intent to EOL LatticeEC/P and LatticeXP Product Families 7/11/13 LatticeEC/P, LatticeXP Discontinuance
05A-13 Advanced Change Notification of Intent to Transfer Lattice MachXO Product Families 7/11/13 MachXO, LA-MachXO Mask Set
04A-13 Notification of a Revision to the iCE40LP/HX Family Data Sheet 7/1/13 iCE40LP384-CM81, iCE40LP384-CM81TR Discontinuance
03B-13 Notification of Intent to Utilize an Alternate Qualified Assembly / Test Site and Alternate Qualified Material Sets for Select Lattice Products 11/17/14 MachXO, MachXO2, LatticeECP2/M, LatticeECP3, LatticeXP2, ispMACH 4000V/B/C/ZC, ispMACH 4000ZE Assembly Site,
Material Set
01A-13 Notification of Changes to the iCE40 LP/HX Family Data Sheet 3/11/13 iCE40 Datasheet
14A-12 Notification of Intent to Discontinue Select Devices in the iCE40 Product Family 7/31/12 iCE40HX640, iCE40LP640 Discontinuance
12A-12 Notification of Changes to iCE Ordering Part Numbers for Tape & Reel Packaging 6/25/12 iCE40 (Select Devices) Other
11A-12 Notification of Changes to Device Topside Mark and Shipping Box/Label Design for iCE Product Families 6/18/12 iCE40, iCE65 Other
09A-12 Notification of Intent to Utilize Alternate Qualified Material Sets and/or Alternate Qualified Assembly Sites for Select Lattice Product Families 5/14/12 ispMACH4000ZE, LatticeEC/P, LatticeECP2/M, LatticeECP3, MachXO, MachXO2, LatticeXP, LatticeXP2 Assembly Site
08B-12 Notification of Intent to Discontinue the iCE65 Product Family 4/9/12 iCE65 Discontinuance
07A-12 Notification of Intent to Utilize an Alternate Qualified Mask Set for the Lattice MachXO2 256ZE Devices 3/19/12 MachXO2 256ZE Mask Set
06B-12 Notification of Changes to the MachXO2 Family Data Sheet 4/16/12 MachXO2 Data Sheet
05B-12 Notification of Change in Lattice Logo affecting Device Topside Mark and Shipping Box/Label Design 2/27/12 All Lattice Products Other
04A-12 Notification of a Revision to the ispMACH 4000ZE Family Data Sheet 2/27/12 LC4032ZE, LC4064ZE, LC4128ZE Data Sheet
03A-12 Notification of a Revision to the LatticeSC/M Family Data Sheet 2/27/12 SC15, SC25, SC40, SC80, SC115,SCM15, SCM25, SCM40, SCM80, SCM115 Data Sheet
02B-12 Notification of a Revision to the LatticeXP2, LA-LatticeXP2 and LatticeECP2/M Data Sheets 1/30/12 LAXP2-5E, LAXP2-8E, LAXP2-17E, LFXP2-5E, LFXP2-5E, LFXP2-8E, LFXP2-17E, LFXP2-30E, LFXP2-40E, LFE2-6E, LFE2-6SE, LFE2-12E, LFE2-12SE, LFE2-20E, LFE2-20SE, LFE2-35E, LFE2-35SE, LFE2-50E, LFE2-50SE, LFE2-70E, LFE2-70SE, LFE2M20E, LFE2M20SE, LFE2M35E, LFE2M35SE, LFE2M50E, LFE2M50SE, LFE2M70E, LFE2M70SE, LFE2M100E, LFE2M100SE Data Sheet
01A-12 Notification of Intent to Utilize an Alternate Qualified Mask Set and Foundry for the ispPAC-POWR Power Manager II Products 1/23/12 ispPAC-POWR605, ispPAC-POWR607, ispPAC-POWR1014, ispPAC-POWR1014A, ispPAC-POWR1220AT8, ispPAC-POWR6AT6 Mask Set
11A-11 Notification of Intent to Discontinue Select Devices 8/1/11 ispLSI 1024EA, ispLSI 2064VE (Select), ispLSI 2128VE (Select), LC51024VG, LC5768VG, LX64EV, LX64V, M4A3-128 (Select), M4A3-256 (Select), M4A3-384 (Select), M5-128/1, M5-192/1, M5-256/1, M5-320, M5-384, M5-512, M5LV-128, M5LV-256, M5LV-320, M5LV-384, M5LV-512, OR2T15A, OR2T26A, OR3T30, OR3T55, ORSO42G5, ORSO82G5, ORT42G5, ORT82G5, ORT8850H, ORT8850L, SC/SCM80 (Select), SC/SCM115 Discontinuance
10A-11 Notification of Intent to Freeze ispLEVER After Version 8.2 7/25/11 ispLEVER Conversion
09A-11 Notification of Intent to Transition from the MachXO2-1200 "R1" to the standard MachXO2-1200 Ordering Part Number 7/18/11 MachXO2-1200-HC/ZE Conversion,
Discontinuance
08A-11 Notification of a Revision to the LatticeSC/SCM Family flexiPCS Data Sheet 6/20/11 LatticeSC, LatticeSCM Data Sheet
- Courtesy Notification of Additional Ejector Pin Sites on Select BGA Packages 7/1/11 Select fpBGA/BGA Package Devices Other
07C-11 Withdrawal of PCN#07B-11 (Notification of Intent to Utilize an Alternate Qualified Material Set for Select Chip Scale BGA, Ultra Chip Scale BGA, Chip Array BGA, Fine Pitch Thin BGA, Fine Pitch BGA and Plastic BGA Packages) 8/1/11 csBGA, ucBGA, caBGA, ftBGA, fpBGA and BGA Packages Material Set
06C-11 Withdrawal of PCN#06B-11(Notification of Intent to Utilize an Alternate Qualified Material Set for Select Thin Quad Flat Pack and Plastic Quad Flat Pack Packages) 8/1/11 TQFP / PQFP Packages Material Set
05A-11 Notification of Intent to Utilize an Alternate Qualified Foundry Process for the LatticeECP3 Products 4/11/11 LatticeECP3 Process
04B-11 Notification of Intent to Utilize an Alternate Qualified Mask Set and Foundry for the ispMACH 4000ZE Products 4/11/11 ispMACH 4000ZE Mask Set
03D-11 Withdrawal of ACN#03C-11(Advanced Change Notification of Intent to Qualify Alternate Material Sets for Select Lattice Package Families) 8/1/11 GALs, ispGALs, ispLSI 1000, ispLSI 1000C, ispLSI 1000E, ispLSI 1000EA, ispLSI 2000A, ispLSI 2000E, ispLSI 2000VE, ispLSI 5000VA, ispLSI 5000VE, ispMACH 4A3, ispMACH 4A5, ispMACH 5000VG, ispXPLD 5000MX, ispXPGA, ispMACH 4000, ispMACH 4000ZE, LatticeEC/ECP, LatticeECP2/M, LatticeECP3, LatticeSC/M, LatticeXP, LatticeXP2, MachXO, MachXO2, ispGDX, ispGDX2, ORCA, ispPAC-CLK, ispPAC-POWR, Platform Manager, Military Products Material Set
02C-11 Notification of Intent to Utilize an Alternate Qualified Mask Set and Foundry and/or an Alternate Qualified Material Set for the ispMACH 4A3-64/64, ispMACH 4A3-128/64, ispMACH 4A5-128/64 and MACH4-128N/64 Products 2/25/11 M4A3-64/64, M4A3-128/64, M4A5-128/64, M4-128N/64 Mask Set,
Material Set
01A-11 Notification of Intent to Utilize an Alternate Qualified Assembly Site and Alternate Qualified Material Set, and Convert Moisture Sensitivity Level for the SnPb 84-PLCC Devices 2/11/11 ispLSI 1032, ispLSI 1032E, ispLSI 2064A, M4-128N 84-PLCC SnPb Package Assembly Site,
Material Set,
Other